- Description :
-
- SLIM-GRID HEADER, 10 CIRCUITS, T (18)
- SLIM-GRID HEADER, 12 CIRCUITS, T (18)
- SLIM-GRID HEADER, 14 CIRCUITS, T (18)
- SLIM-GRID HEADER, 16 CIRCUITS, T (18)
- SLIM-GRID HEADER, 18 CIRCUITS, T (18)
- SLIM-GRID HEADER, 20 CIRCUITS, T (18)
- SLIM-GRID HEADER, 22 CIRCUITS, T (18)
- SLIM-GRID HEADER, 24 CIRCUITS, T (18)
- SLIM-GRID HEADER, 4 CIRCUITS, TH (18)
- SLIM-GRID HEADER, 6 CIRCUITS, TH (18)
- SLIM-GRID HEADER, 8 CIRCUITS, TH (18)
198 산물
| 그림 | 모델 | 가격 | 양 | 재고 | 제조사 | 기술 | Series | Packaging | Operating Temperature Range | Current Rating | Voltage Rating | Number of Positions | Number of Rows | Contact Material | Row Spacing | Connector Type | Mounting Type | Contact Type | Features | Style | Termination | Insulation Material | Description | |
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전망 | Molex, LLC | SLIM-GRID HEADER, 24 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 24 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 22 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 22 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 20 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 20 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 18 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 18 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 16 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 16 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 14 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 14 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 12 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 12 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 10 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 10 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 8 CIRCUITS, TH | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 8 CIRCUITS, TH | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 6 CIRCUITS, TH | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 6 CIRCUITS, TH | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 4 CIRCUITS, TH | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 4 CIRCUITS, TH | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 24 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 24 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 22 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 22 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 20 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 20 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 18 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 18 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 16 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 16 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 14 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 14 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 12 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 12 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 10 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 10 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 8 CIRCUITS, TH | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 8 CIRCUITS, TH | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 6 CIRCUITS, TH | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 6 CIRCUITS, TH | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 4 CIRCUITS, TH | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 4 CIRCUITS, TH | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 24 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 24 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 22 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 22 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 20 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 20 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 18 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 18 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 16 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 16 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 14 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 14 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 12 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 12 CIRCUITS, T | |||
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전망 | Molex, LLC | SLIM-GRID HEADER, 10 CIRCUITS, T | Slim-Grid 201022 | Tube | -55°C ~ 105°C | - | 125V | All | 2 | Copper Alloy | 0.050" (1.27mm) | Header | Through Hole | Male Pin | Pick and Place | Board to Board | Solder | Liquid Crystal Polymer (LCP), Glass Filled | SLIM-GRID HEADER, 10 CIRCUITS, T |
