5 산물
| 그림 | 모델 | 가격 | 양 | 재고 | 제조사 | 기술 | Series | Packaging | Operating Temperature Range | Current Rating | Voltage Rating | Number of Positions | Number of Rows | Contact Material | Connector Type | Mounting Type | Contact Type | Features | Style | Termination | Insulation Material | Description | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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전망 | TE Connectivity AMP Connectors | BOARD TO WIRE WAFER 1.2MM TOP EN | High Performance Interconnect (HPI) | Tape - Reel (TR) | -25°C ~ 85°C | - | 50VAC | All | 1 | Phosphor Bronze | Header | Surface Mount, Right Angle | Tab | Solder Retention | Board to Cable/Wire | Solder | Liquid Crystal Polymer (LCP), Glass Filled | BOARD TO WIRE WAFER 1.2MM TOP EN | |||
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전망 | TE Connectivity AMP Connectors | BOARD TO WIRE WAFER 1.2MM TOP EN | High Performance Interconnect (HPI) | Tape - Reel (TR) | -25°C ~ 85°C | - | 50VAC | All | 1 | Phosphor Bronze | Header | Surface Mount, Right Angle | Tab | Solder Retention | Board to Cable/Wire | Solder | Liquid Crystal Polymer (LCP), Glass Filled | BOARD TO WIRE WAFER 1.2MM TOP EN | |||
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전망 | TE Connectivity AMP Connectors | BOARD TO WIRE WAFER 1.2MM TOP EN | High Performance Interconnect (HPI) | Tape - Reel (TR) | -25°C ~ 85°C | - | 50VAC | All | 1 | Phosphor Bronze | Header | Surface Mount, Right Angle | Tab | Solder Retention | Board to Cable/Wire | Solder | Liquid Crystal Polymer (LCP), Glass Filled | BOARD TO WIRE WAFER 1.2MM TOP EN | |||
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전망 | TE Connectivity AMP Connectors | BOARD TO WIRE WAFER 1.2MM TOP EN | High Performance Interconnect (HPI) | Tape - Reel (TR) | -25°C ~ 85°C | - | 50VAC | All | 1 | Phosphor Bronze | Header | Surface Mount, Right Angle | Tab | Solder Retention | Board to Cable/Wire | Solder | Liquid Crystal Polymer (LCP), Glass Filled | BOARD TO WIRE WAFER 1.2MM TOP EN | |||
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전망 | TE Connectivity AMP Connectors | BOARD TO WIRE WAFER 1.2MM TOP EN | High Performance Interconnect (HPI) | Tape - Reel (TR) | -25°C ~ 85°C | - | 50VAC | All | 1 | Phosphor Bronze | Header | Surface Mount, Right Angle | Tab | Solder Retention | Board to Cable/Wire | Solder | Liquid Crystal Polymer (LCP), Glass Filled | BOARD TO WIRE WAFER 1.2MM TOP EN |
