- Insulation Material :
4 산물
| 그림 | 모델 | 가격 | 양 | 재고 | 제조사 | 기술 | Series | Packaging | Current Rating | Number of Positions | Number of Rows | Contact Material | Row Spacing | Connector Type | Mounting Type | Contact Type | Features | Style | Termination | Insulation Material | Description | |
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견적을 받아 |
9,759
재고
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Molex, LLC | CONN HEADER 10POS 3MM RT ANG TIN | Micro-Fit 3.0 43045 | Tray | - | All | 2 | Brass | 0.118" (3.00mm) | Header | Through Hole, Right Angle | Male Pin | Board Lock | Board to Cable/Wire | Solder | Liquid Crystal Polymer (LCP), Glass Filled | CONN HEADER 10POS 3MM RT ANG TIN | ||
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견적을 받아 |
1,627
재고
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Molex Connector Corporation | CONN HEADER 10POS 3MM RT ANG TIN | Micro-Fit 3.0 BMI 44428 | Tray | - | All | 2 | Brass | 0.118" (3.00mm) | Header | Through Hole, Right Angle | Male Pin | Board Lock | Board to Board or Cable | Solder | Polyamide (PA), Nylon, Glass Filled | CONN HEADER 10POS 3MM RT ANG TIN | ||
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견적을 받아 |
1,189
재고
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Molex Connector Corporation | CONN HEADER 10POS 3MM RT ANG TIN | Micro-Fit 3.0 43650 | Tray | - | All | 1 | Brass | - | Header | Through Hole, Right Angle | Male Pin | Board Lock | Board to Cable/Wire | Solder | Liquid Crystal Polymer (LCP), Glass Filled | CONN HEADER 10POS 3MM RT ANG TIN | ||
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견적을 받아 |
4,308
재고
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Molex Connector Corporation | CONN HEADER 10POS 3MM RT ANG TIN | Micro-Fit 3.0 43650 | Tray | - | All | 1 | Brass | - | Header | Through Hole, Right Angle | Male Pin | Board Lock | Board to Cable/Wire | Solder | Liquid Crystal Polymer (LCP), Glass Filled | CONN HEADER 10POS 3MM RT ANG TIN |
