- Packaging :
- Mounting Type :
- Operating Temperature :
- Voltage - Supply :
- Supplier Device Package :
53 산물
| 그림 | 모델 | 가격 | 양 | 재고 | 제조사 | 기술 | Package / Case | Series | Packaging | Memory Type | Memory Size | Mounting Type | Operating Temperature | Part Status | Memory Format | Clock Frequency | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 1.8 V ~ 5.5 V | Die | 0 | 0 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 1.8 V ~ 5.5 V | Die | 0 | 0 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 1.8 V ~ 5.5 V | Die | 0 | 0 | |||
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전망 | ON Semiconductor | IC EEPROM 1KBIT 4MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 4MHz | - | SPI | 1.8 V ~ 5.5 V | 8-TDFN | 0 | 0 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 2MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 2MHz | 10ms | SPI | 1.8 V ~ 5.5 V | 8-SOIC | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 2MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tube | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 2MHz | 10ms | SPI | 2.5 V ~ 5.5 V | 8-SOIC | 0 | 900 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 2MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 2MHz | 10ms | SPI | 2.5 V ~ 5.5 V | 8-SOIC | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 2MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 2MHz | 10ms | SPI | 2.5 V ~ 5.5 V | 8-SOIC | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 2MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tube | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 2MHz | 10ms | SPI | 2.5 V ~ 5.5 V | 8-SOIC | 0 | 900 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 2MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 2MHz | 10ms | SPI | 2.5 V ~ 5.5 V | 8-SOIC | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 2MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 2MHz | 10ms | SPI | 2.5 V ~ 5.5 V | 8-SOIC | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 2MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 2MHz | 10ms | SPI | 1.8 V ~ 5.5 V | 8-SOIC | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8DIP | 8-DIP (0.300", 7.62mm) | - | Tube | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Through Hole | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-PDIP | 0 | 1140 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8MSOP | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-MSOP | 0 | 2500 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8MSOP | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | - | Tube | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-MSOP | 0 | 1100 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8TSSOP | 8-TSSOP (0.173", 4.40mm Width) | - | Tube | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-TSSOP | 0 | 1100 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8TSSOP | 8-TSSOP (0.173", 4.40mm Width) | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-TSSOP | 0 | 2500 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8DFN | 8-VFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-DFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8DFN | 8-VFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 1.8 V ~ 5.5 V | 8-DFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8DIP | 8-DIP (0.300", 7.62mm) | - | Tube | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Through Hole | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 1.8 V ~ 5.5 V | 8-PDIP | 0 | 1440 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tube | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-SOIC | 0 | 1200 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-SOIC | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-SOIC | 0 | 3300 |
