- Package / Case :
-
- 8-DIP (0.300", 7.62mm) (65)
- 8-SOIC (0.154", 3.90mm Width) (157)
- 8-SOIC (0.173", 4.40mm Width) (18)
- 8-TSSOP (0.173", 4.40mm Width) (107)
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) (105)
- 8-UFDFN Exposed Pad (11)
- 8-VFDFN Exposed Pad (15)
- 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) (13)
- 8-WFDFN Exposed Pad (25)
- Die (150)
- SOT-23-6 (40)
- Packaging :
- Memory Size :
-
- 16Kb (1K x 16) (52)
- 16Kb (2K x 8) (49)
- 16Kb (2K x 8, 1K x 16) (78)
- 1Kb (128 x 8 , 64 x 16) (41)
- 1Kb (128 x 8, 64 x 16) (23)
- 1Kb (64 x 16) (11)
- 2Kb (128 x 16) (11)
- 2Kb (256 x 8, 128 x 16) (70)
- 32Kb (4K x 8) (9)
- 4Kb (256 x 16) (15)
- 4Kb (512 x 8) (11)
- 4Kb (512 x 8, 256 x 16) (64)
- 64Kb (8K x 8) (3)
- 8Kb (1K x 8) (49)
- 8Kb (1K x 8, 512 x 16) (73)
- 8Kb (512 x 16) (52)
- Mounting Type :
- Operating Temperature :
611 산물
그림 | 모델 | 가격 | 양 | 재고 | 제조사 | 기술 | Package / Case | Series | Packaging | Memory Type | Memory Size | Mounting Type | Operating Temperature | Part Status | Memory Format | Clock Frequency | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 |