- Packaging :
- Memory Size :
-
- 16Kb (1K x 16) (16)
- 16Kb (2K x 8) (16)
- 16Kb (2K x 8, 1K x 16) (26)
- 1Kb (128 x 8) (26)
- 1Kb (128 x 8, 64 x 16) (23)
- 1Kb (64 x 16) (36)
- 2Kb (128 x 16) (19)
- 2Kb (256 x 8) (19)
- 2Kb (256 x 8, 128 x 16) (26)
- 4Kb (256 x 16) (20)
- 4Kb (512 x 8) (19)
- 4Kb (512 x 8, 256 x 16) (26)
- 8Kb (1K x 8) (16)
- 8Kb (1K x 8, 512 x 16) (23)
- 8Kb (512 x 16) (16)
- Mounting Type :
- Operating Temperature :
- Clock Frequency :
- Voltage - Supply :
- Supplier Device Package :
327 산물
그림 | 모델 | 가격 | 양 | 재고 | 제조사 | 기술 | Package / Case | Series | Packaging | Memory Type | Memory Size | Mounting Type | Operating Temperature | Part Status | Memory Format | Clock Frequency | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8, 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8, 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8, 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8, 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8, 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | ||||
|
전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8, 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 |