- Operating Temperature :
- Voltage - Supply :
25 산물
| 그림 | 모델 | 가격 | 양 | 재고 | 제조사 | 기술 | Package / Case | Series | Packaging | Memory Type | Memory Size | Mounting Type | Operating Temperature | Part Status | Memory Format | Clock Frequency | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
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전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 16K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8, 64 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 4K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 2K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8, 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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전망 | Microchip Technology | IC EEPROM 1K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 |
