- Memory Size :
- Mounting Type :
17 산물
| 그림 | 모델 | 가격 | 양 | 재고 | 제조사 | 기술 | Package / Case | Series | Packaging | Memory Type | Memory Size | Access Time | Mounting Type | Operating Temperature | Part Status | Memory Format | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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전망 | Microchip Technology | IC EEPROM 1M PARALLEL 30CPGA | 30-BCPGA | - | Tray | Non-Volatile | 1Mb (128K x 8) | 250ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 30-CPGA (16.51x13.97) | 0 | 0 | |||
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전망 | Microchip Technology | IC EEPROM 1M PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 0 | |||
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전망 | Microchip Technology | IC EEPROM 1M PARALLEL 32CDIP | 32-CDIP (0.600", 15.24mm) Window | - | Tube | Non-Volatile | 1Mb (128K x 8) | 250ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-CDIP | 0 | 12 | |||
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전망 | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 28CDIP | 28-CDIP (0.600", 15.24mm) | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-CDIP | 0 | 14 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 28CDIP | 28-CDIP (0.600", 15.24mm) | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-CDIP | 0 | 14 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 32CLCC | 32-CLCC | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 32CLCC | 32-CLCC | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 32CLCC | 32-CLCC | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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견적을 받아 |
14
재고
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Microchip Technology | IC EEPROM 256K PARALLEL 28CDIP | 28-CDIP (0.600", 15.24mm) | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-CDIP | 0 | 1 | ||
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견적을 받아 |
14
재고
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Microchip Technology | IC EEPROM 256K PARALLEL 28CDIP | 28-CDIP (0.600", 15.24mm) | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-CDIP | 0 | 1 |
