- Packaging :
- Memory Size :
- Operating Temperature :
- Part Status :
6 산물
그림 | 모델 | 가격 | 양 | 재고 | 제조사 | 기술 | Package / Case | Series | Packaging | Memory Type | Memory Size | Technology | Access Time | Mounting Type | Operating Temperature | Part Status | Memory Format | Clock Frequency | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
전망 | Winbond Electronics | IC DRAM 16M PARALLEL 60VFBGA | 60-TFBGA | - | Tray | Volatile | 16Mb (1M x 16) | SDRAM | 5ns | Surface Mount | 0°C ~ 70°C (TA) | Obsolete | DRAM | 166MHz | Parallel | 3 V ~ 3.6 V | 60-VFBGA (6.4x10.10) | 0 | 286 | ||||
|
전망 | Winbond Electronics | IC DRAM 64M PARALLEL 60VFBGA | 60-TFBGA | - | Tray | Volatile | 64Mb (4M x 16) | SDRAM | 5ns | Surface Mount | 0°C ~ 70°C (TA) | Obsolete | DRAM | 166MHz | Parallel | 3 V ~ 3.6 V | 60-VFBGA (6.4x10.10) | 0 | 286 | ||||
|
전망 | Winbond Electronics | IC DRAM 16M PARALLEL 60VFBGA | 60-TFBGA | - | Tray | Volatile | 16Mb (1M x 16) | SDRAM | 5ns | Surface Mount | -40°C ~ 85°C (TA) | Active | DRAM | 166MHz | Parallel | 3 V ~ 3.6 V | 60-VFBGA (6.4x10.10) | 0 | 286 | ||||
|
전망 | Winbond Electronics | IC DRAM 16M PARALLEL 60VFBGA | 60-TFBGA | - | Tape & Reel (TR) | Volatile | 16Mb (1M x 16) | SDRAM | 5ns | Surface Mount | -40°C ~ 85°C (TA) | Active | DRAM | 166MHz | Parallel | 3 V ~ 3.6 V | 60-VFBGA (6.4x10.10) | 0 | 2000 | ||||
|
전망 | Winbond Electronics | IC DRAM 16M PARALLEL 60VFBGA | 60-TFBGA | - | Tray | Volatile | 16Mb (1M x 16) | SDRAM | 5ns | Surface Mount | 0°C ~ 70°C (TA) | Active | DRAM | 166MHz | Parallel | 3 V ~ 3.6 V | 60-VFBGA (6.4x10.10) | 0 | 286 | ||||
|
전망 | Winbond Electronics | IC DRAM 16M PARALLEL 60VFBGA | 60-TFBGA | - | Tape & Reel (TR) | Volatile | 16Mb (1M x 16) | SDRAM | 5ns | Surface Mount | 0°C ~ 70°C (TA) | Active | DRAM | 166MHz | Parallel | 3 V ~ 3.6 V | 60-VFBGA (6.4x10.10) | 0 | 2000 |