- Package / Case :
- Memory Size :
- Mounting Type :
- Operating Temperature :
- Part Status :
- Memory Format :
- Supplier Device Package :
7 산물
| 그림 | 모델 | 가격 | 양 | 재고 | 제조사 | 기술 | Package / Case | Series | Packaging | Memory Type | Memory Size | Technology | Access Time | Mounting Type | Operating Temperature | Part Status | Memory Format | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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전망 | Renesas Electronics America Inc. | IC NVSRAM 4K PARALLEL 28DIP | 28-DIP (0.600", 15.24mm) | - | Tube | Non-Volatile | 4Kb (512 x 8) | NVSRAM (Non-Volatile SRAM) | 150ns | Through Hole | 0°C ~ 70°C (TA) | Obsolete | NVSRAM | 150ns | Parallel | 4.5 V ~ 5.5 V | 28-PDIP | 0 | 15 | |||
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전망 | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 3ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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전망 | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 |
