- Voltage - Supply :
- Supplier Device Package :
6 산물
| 그림 | 모델 | 가격 | 양 | 재고 | 제조사 | 기술 | Package / Case | Series | Packaging | Memory Type | Memory Size | Technology | Mounting Type | Operating Temperature | Part Status | Memory Format | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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전망 | Winbond Electronics | IC FLASH 2G PARALLEL 63VFBGA | 63-VFBGA | - | Tray | Non-Volatile | 2Gb (256M x 8) | FLASH - NAND (SLC) | Surface Mount | -40°C ~ 85°C (TA) | Active | Flash | 35ns | Parallel | 1.7 V ~ 1.95 V | 63-VFBGA (9x11) | 0 | 210 | |||
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전망 | Winbond Electronics | IC FLASH 2G PARALLEL 63VFBGA | 63-VFBGA | - | Tray | Non-Volatile | 2Gb (256M x 8) | FLASH - NAND (SLC) | Surface Mount | -40°C ~ 85°C (TA) | Active | Flash | 35ns | Parallel | 1.7 V ~ 1.95 V | 63-VFBGA (9x11) | 0 | 210 | |||
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전망 | Winbond Electronics | IC FLASH 2G PARALLEL 63VFBGA | 63-VFBGA | - | Tray | Non-Volatile | 2Gb (256M x 8) | FLASH - NAND (SLC) | Surface Mount | -40°C ~ 85°C (TA) | Active | Flash | 25ns | Parallel | 2.7 V ~ 3.6 V | 63-VFBGA (9x11) | 0 | 210 | |||
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전망 | Toshiba Memory America, Inc. | 2G NAND SLC 24NM BGA | 63-VFBGA | - | - | Non-Volatile | 2Gb (256M x 8) | FLASH - NAND (SLC) | Surface Mount | -40°C ~ 85°C (TA) | Active | Flash | 25ns | - | 1.7 V ~ 1.95 V | 63-TFBGA (9x11) | 0 | 210 | |||
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전망 | Toshiba Memory America, Inc. | 2GB SLC NAND BGA 24NM I TEMP (EE | 63-VFBGA | Benand™ | - | Non-Volatile | 2Gb (256M x 8) | FLASH - NAND (SLC) | Surface Mount | -40°C ~ 85°C (TA) | Active | Flash | 25ns | - | 1.7 V ~ 1.95 V | 63-TFBGA (9x11) | 0 | 210 | |||
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전망 | Toshiba Memory America, Inc. | 2GB SLC BENAND 24NM BGA 9X11 (EE | 63-VFBGA | Benand™ | - | Non-Volatile | 2Gb (256M x 8) | FLASH - NAND (SLC) | Surface Mount | -40°C ~ 85°C (TA) | Active | Flash | 25ns | - | 2.7 V ~ 3.6 V | 63-TFBGA (9x11) | 0 | 210 |
