- Mounting Style :
- Height :
- Heatsink Material :
- Thermal Resistance :
5 산물
그림 | 모델 | 가격 | 양 | 재고 | 제조사 | 기술 | Product | Mounting Style | Length | Height | Designed for | Heatsink Material | Thermal Resistance | Fin Style | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
견적을 받아 |
1,101
재고
|
Wakefield-Vette | Heat Sinks 1.378 X.45" 35mm BGA H/S | Heat Sinks | Adhesive | 35 mm | 11.4 mm | BGA semiconductors | Aluminum | Extruded Axial Fin | ||||
|
견적을 받아 |
1,000
재고
|
Wakefield-Vette | Heat Sinks LP H/S BGA Chipset 35X35X21 | Heat Sinks | Clip | 35 mm | 21 mm | BGA semiconductors | Aluminium Alloy | 2.11 C/W | ||||
|
견적을 받아 |
1,000
재고
|
Wakefield-Vette | Heat Sinks LP H/S BGA Chipset 35X35X12 | Heat Sinks | Clip | 35 mm | 12 mm | BGA semiconductors | Aluminium Alloy | 3.83 C/W | ||||
|
견적을 받아 |
1,000
재고
|
Wakefield-Vette | Heat Sinks LP H/S BGA Chipset 35X35X12.5 | Heat Sinks | Clip | 35 mm | 12.5 mm | BGA semiconductors | Aluminium Alloy | 3.63 C/W | ||||
|
견적을 받아 |
1,000
재고
|
Wakefield-Vette | Heat Sinks LP H/S BGA Chipset 35X35X15 | Heat Sinks | Clip | 35 mm | 15 mm | BGA semiconductors | Aluminium Alloy | 3.15 C/W |